Recently, the new product of 1.7-micron PET ultra-thin film for capacitors independently developed by TSF Company has successfully achieved trial production. The product has successfully passed the verification of metalization evaporation and capacitor manufacturing, and its performance is qualified, achieving small batch supply. At present, TSF Company has steadily produced finished films of this specification and sent samples to multiple customers, marking an important technological breakthrough in the field of PET ultra-thin films for capacitors.

In the field of high-end capacitor film materials, the thickness of the film largely determines the technological height of the product. Every 0.1 micron reduction in film thickness means that capacitors can store more energy at the same volume, or achieve smaller capacitor volumes at the same capacity, better meeting the market's demand for high energy density and miniaturization of capacitors for new energy.

TSF Company continues to deepen its research and development of PET ultra-thin film products by leveraging the advantages of its integrated industry chain of "capacitor film metalized film thin film capacitor". In 2016 and 2018, we successfully developed 2.2-micron and 1.9-micron ultra-thin film products, forming a strong technological accumulation. On this basis, the R&D team has undergone multiple rounds of process innovation and equipment improvement, once again breaking through the key technology of 1.7 micron ultra-thin film production, further enhancing product added value and market competitiveness, and providing solid support for accelerating the expansion of high-end application markets.